Simulation software to predict interfacial bonding environments

Deterministic simulation software predicts the spatial distribution of micro-environments under which adhesive bonds must cure and gain strength in the synthesis of diverse composite products and components. Incorporating ABES bonding kinetics data in such models enables thermally and chemically driven 3-D mappings of adhesion to be generated. Such models may be used as tools for both process optimization and adhesive tailoring.

AES has expertise to address adhesion dynamics in many fields – including composite material formation and bonding dynamics in structural, aerospace, electronics and bio-medical fields. Example cross-sectional temperature and consequent inter-fiber bond strength profiles within a bio-composite panel as it passes through an industrial continuous press is shown.