Dynamic bond cooling
Computer controlled gas cooling of bonds
The ABES system is equipped with a miniature device to precisely apply regulated cooling gas onto partially cured bonds. This enables bonds to be cured normally at any temperature ranging from ambient to 265°C, and then rapidly (within 5 seconds) cooled to any lower target temperature. This enables the thermoplastic characteristics of adhesives (both thermoplastics and hot melts, and those that are predominantly thermosetting) to be explored at every stage of cure or melting. It also enables curing to be halted at any stage for further analysis of removed samples. The head’s activation and the metering of cooling gas is dynamically controlled from the software.