A suite of accessories may be easily installed on the ABES platform or support its function. Precision sample cutting and electronically metered micro-adhesive application onto bonding surfaces is provided. Further, computer activated chemical and water vapor injection with the option of passive or active moisture and chemical containment and control enables test bonds to be formed and immediately thereafter tested under a wide range of dynamically controlled conditions. High temperature pressing (up to 265°C), dynamic bond cooling, high sensitivity bond and material testing (from 2.5kN down to 10N full scale with 0.02N resolution) modes are available. The necessary load cells and displacement transducers may be easily interchanged. Highly flexible and user friendly icon-based control and data collection software is provided.